What is Burn in?

Burn in refers to the use of high-temperature methods to impose environmental stress on products, while environmental stress screening (ESS: Environment Stress Screen) includes not only high-temperature stress, but also many other stresses, such as temperature cycling, random vibration, etc., as shown in the figure Show. Therefore, aging is a kind of environmental stress screening. But now many companies have expanded the meaning of the word "aging". Aging is equivalent to environmental stress screening. Environmental stress screening is commonly referred to as aging. We will continue to use the word "aging".

Burn in

Why must electronic products undergo a 100% burn-in test before they leave the factory;

Because in the processing of electronic products, due to complex processing and extensive use of components and materials, various defects will be introduced (even if the product is well designed). Whether it is a processing defect or a component defect, it can be divided into obvious defects and latent defects. Obvious defects refer to those defects that cause the product to fail to work normally, such as short circuits/open circuits. Potential defects cause the product to be temporarily usable, but the defects will be quickly exposed during use, and the product will not work properly, such as insufficient solder. Although the product can be used, slight vibration may cause the solder joint to open. Obvious defects can be inspected by conventional inspection methods (ie ICT: In-Circuit Test, In-Circuit Test, which is to check the manufacturing defects and components by testing the electrical properties and electrical connections of online components (components on the board) A bad standard test method. It mainly checks the on-line individual components and the open and short-circuit conditions of each circuit network. It has the characteristics of simple operation, fast and rapid, accurate fault location, FT, etc.) to find out. Latent defects cannot be found by conventional inspection methods, but are eliminated by aging methods. If the aging method is not effective, the potential defects that have not been eliminated will eventually show up in the form of early failure (or failure) during the operation of the product, which will lead to an increase in the rate of product repair and an increase in maintenance costs.

Electronic products are fully aging tested before they leave the factory, which greatly reduces the defect rate of products.

In fact, the purpose of aging has a more important purpose (same as testing): continuous improvement of product processing technology through aging, continuous improvement of component quality, and improvement until aging is unnecessary. The circuit board must be tested after aging. If a component is found to be frequently damaged during the test, it means that the device has potential defects and the supplier needs to improve its quality.